US 12,131,929 B2
Wafer inspection method
Myoung Hoon Woo, Cheonan-si (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Nov. 24, 2021, as Appl. No. 17/534,716.
Claims priority of application No. 10-2020-0184881 (KR), filed on Dec. 28, 2020.
Prior Publication US 2022/0208580 A1, Jun. 30, 2022
Int. Cl. G06K 9/00 (2022.01); G06T 7/00 (2017.01); G06T 7/11 (2017.01); G06T 7/70 (2017.01); G06T 7/90 (2017.01); H01L 21/67 (2006.01)
CPC H01L 21/67288 (2013.01) [G06T 7/0004 (2013.01); G06T 7/11 (2017.01); G06T 7/70 (2017.01); G06T 7/90 (2017.01); G06T 2207/10024 (2013.01); G06T 2207/30148 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A wafer inspection method comprising:
acquiring an inspection image from an edge region of a wafer;
generating a color profile of the inspection image in a radial direction of the wafer; and
detecting a side surface of a layer formed on the wafer based on a change in the color profile in a first direction from a side surface of the wafer toward a center of the wafer,
wherein the detecting the side surface of the layer comprises:
selecting one color from among red, green and blue according to a color of the layer;
searching a color ratio profile corresponding to the selected color from among the color ratio profiles in the first direction to detect a pixel having a predetermined color ratio of the selected color; and
searching the color ratio profile in the first direction from the detected pixel to detect a second pixel having the predetermined color ratio of the selected color when a color level value of the selected color of the detected pixel or a gray level value of the detected pixel is lower than a predetermined value.