CPC H01L 21/67219 (2013.01) [B24B 29/04 (2013.01); B24B 37/013 (2013.01); B24B 37/105 (2013.01); B24B 49/10 (2013.01); H01L 21/30625 (2013.01); H01L 21/67028 (2013.01); H01L 21/67034 (2013.01); H01L 21/67173 (2013.01); H01L 21/67178 (2013.01); H01L 21/67184 (2013.01); H01L 21/67748 (2013.01); H01L 22/26 (2013.01)] | 9 Claims |
1. A polishing apparatus for polishing a polishable object, the polishing apparatus comprising:
a polishing table that can hold a polishing pad;
a first electric motor that can drive to rotate the polishing table;
a holding section that can hold the polishable object and press the polishable object against the polishing pad;
a second electric motor that can drive to rotate the holding section;
a swing arm for holding the holding section;
a third electric motor that can swing the swing arm around a swing center of the swing arm;
detection circuitry configured to detect at least one of an electric current value of one electric motor of the first, second, or third electric motors, a torque command value of the one electric motor, a position command of the one electric motor, and a speed command of the one electric motor and generate a first output;
first processing circuitry configured to obtain a contact pressure corresponding to the first output from the first output using first data indicating a correspondence relationship between the contact pressure and the first output; and
second processing circuitry configured to obtain a second output corresponding to the contact pressure obtained by the first processing circuitry using second data indicating a correspondence relationship between the contact pressure obtained by the first processing circuitry and the second output,
wherein the second output is at least one of a corrected electric current value of the one electric motor, a corrected torque command value of the one electric motor, a corrected position command of the one electric motor, or a corrected speed command of the one electric motor, and
wherein the same second data can be used in a second polishing apparatus to obtain substantially the same second output for the same contact pressure using the same second data in the second polishing apparatus.
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