| CPC H01L 21/67132 (2013.01) [B32B 41/00 (2013.01); B32B 43/006 (2013.01); H01L 21/6838 (2013.01); B32B 2310/028 (2013.01); B32B 2310/0831 (2013.01); B32B 2457/14 (2013.01); Y10T 156/1132 (2015.01); Y10T 156/1158 (2015.01); Y10T 156/1917 (2015.01); Y10T 156/1944 (2015.01)] | 16 Claims |
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1. A manufacturing apparatus for manufacturing a semiconductor device by bonding one or more chips, which each has a bonding surface and a holding surface opposite to the bonding surface, to a bonding target, the manufacturing apparatus comprising:
a wafer holding device holding the one or more chips with the holding surface adhesively held on a surface of a dicing tape together with the dicing tape, wherein the wafer holding device comprises a ring;
a pickup device comprising a pickup head that holds a target chip, which is a chip to be picked up among the one or more chips, in a non-contact manner and picking up the target chip from the dicing tape;
an energy irradiation device irradiating energy, which is light or heat, in an area-selective manner toward the target chip from a back surface side of the dicing tape to reduce an adhesive force of the dicing tape; and
a controller controlling an operation of the pickup device and the energy irradiation device,
wherein an adhesive layer of the dicing tape is a self-peeling adhesive layer having an adhesive force that decreases with irradiation of the energy and floats the target chip by a distance, and
the controller controls a position of the pickup head so that the target chip and the pickup head do not come into contact with each other even if the target chip floats during a takeoff preparation period from bringing the pickup head close to the target chip for pickup to taking off the target chip from the dicing tape.
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