US 12,131,907 B2
Device and method for bonding of substrates
Thomas Wagenleitner, Aurolzmunster (AT); Thomas Plach, Stadl-Paura (AT); and Jurgen Markus Suss, Rainbach (AT)
Assigned to EV Group E. Thallner GmbH, St. Florian am Inn (AT)
Appl. No. 16/080,156
Filed by EV Group E. Thallner GmbH, St. Florian am Inn (AT)
PCT Filed Mar. 22, 2016, PCT No. PCT/EP2016/056249
§ 371(c)(1), (2) Date Aug. 27, 2018,
PCT Pub. No. WO2017/162272, PCT Pub. Date Sep. 28, 2017.
Prior Publication US 2019/0019678 A1, Jan. 17, 2019
Int. Cl. H01L 21/20 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 23/32 (2006.01)
CPC H01L 21/2007 (2013.01) [H01L 21/67092 (2013.01); H01L 21/67288 (2013.01); H01L 21/6838 (2013.01); H01L 23/32 (2013.01)] 6 Claims
OG exemplary drawing
 
2. A method for bonding substrates comprising: providing a first substrate having a contact face and a second substrate having a contact face; holding the first substrate to a first holding surface of a first holding device; holding the second substrate to a second holding surface of a second holding device, wherein the contact face of the first substrate faces the contact face of the second substrate; contacting the contact face of the first substrate with the contact face of the second substrate, wherein the contact faces of the first and/or second substrates have a respective curvature before the contacting of the contact faces; bonding the first substrate with the second substrate at the contact faces of the first and second substrates; and controlling during the bonding a change in the curvature of the contact face of the first substrate and/or controlling a change in the curvature of the contact face of the second substrate, wherein controlling includes implementing closed-loop control of at least one of the curvature of the contact face of the first substrate or the curvature of the contact face of the second substrate, wherein the first substrate and/or the second substrate are fixed by a fixing device arranged in a ring-shaped manner, at the periphery of the first and second holding surfaces solely in the region of side edges of the first and second substrates.