US 12,131,870 B2
Multi-layer ceramic electronic component, and circuit board
Tomoki Sakai, Takasaki (JP)
Assigned to TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed by TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed on Jun. 9, 2023, as Appl. No. 18/332,176.
Application 18/332,176 is a continuation of application No. 17/317,735, filed on May 11, 2021, granted, now 11,715,604.
Claims priority of application No. 2020-087445 (JP), filed on May 19, 2020.
Prior Publication US 2023/0326681 A1, Oct. 12, 2023
Int. Cl. H01G 4/30 (2006.01); C04B 35/468 (2006.01); H01G 2/06 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01)
CPC H01G 4/30 (2013.01) [C04B 35/468 (2013.01); H01G 2/065 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01); C04B 2235/66 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A multi-layer ceramic electronic component, comprising:
a ceramic body including internal electrodes laminated and drawn to a surface of the ceramic body; and
an external electrode including
a base film disposed on the surface of the ceramic body, connected to the internal electrodes, and formed from an electrically conductive material,
a first nickel film disposed on and in contact with the base film in a thickness direction of the base film, and
a second nickel film disposed on the first nickel film in a thickness direction of the first nickel film,
wherein a surface of the first nickel film is oxidized, forming an oxide film between the first nickel film and the second nickel film.