US 12,131,054 B2
Storage device
Kyoung Eun Lee, Hwaseong-si (KR); Yusuf Cinar, Yongin-si (KR); Hyun Joon Yoo, Suwon-si (KR); and Byung Il Lee, Seoul (KR)
Assigned to Samsung Electronics Co., Ltd., (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jul. 29, 2022, as Appl. No. 17/877,297.
Claims priority of application No. 10-2021-0155687 (KR), filed on Nov. 12, 2021; and application No. 10-2022-0019636 (KR), filed on Feb. 15, 2022.
Prior Publication US 2023/0153014 A1, May 18, 2023
Int. Cl. G06F 3/06 (2006.01); G06F 1/18 (2006.01)
CPC G06F 3/0653 (2013.01) [G06F 1/181 (2013.01); G06F 3/0619 (2013.01); G06F 3/0652 (2013.01); G06F 3/0656 (2013.01); G06F 3/0679 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A storage device comprising:
a memory module including a memory device, a module board including a memory controller configured to control the memory device, and a memory connector disposed on one side of the module board;
a first enclosure disposed on a first surface of the memory module;
a second enclosure disposed on a second surface opposite to the first surface of the memory module; and
a first sensor disposed on the first enclosure and configured to detect a state and provide a signal for the state to the memory controller,
wherein the first sensor comprises an external temperature sensor disposed on an outer surface of the first enclosure, the external temperature sensor being configured to measure an external temperature of the first enclosure and to provide measurement data to the memory controller, and
wherein the outer surface of the first enclosure on which the external temperature sensor is disposed faces away from the first surface of the memory module.