US 12,130,485 B1
Stacked-dies optically bridged multicomponent package
Philip Winterbottom, San Jose, CA (US); David Lazovsky, Los Gatos, CA (US); Ankur Aggarwal, Pleasanton, CA (US); Martinus Bos, San Jose, CA (US); and Subal Sahni, La Jolla, CA (US)
Assigned to Celestial AI Inc., Santa Clara, CA (US)
Filed by Celestial AI Inc., Santa Clara, CA (US)
Filed on Mar. 20, 2024, as Appl. No. 18/610,431.
Application 18/610,431 is a division of application No. 18/243,474, filed on Sep. 7, 2023.
Application 18/243,474 is a continuation of application No. 18/123,083, filed on Mar. 17, 2023, granted, now 11,835,777, issued on Dec. 5, 2023.
Claims priority of provisional application 63/321,453, filed on Mar. 18, 2022.
Claims priority of provisional application 63/420,330, filed on Oct. 28, 2022.
Claims priority of provisional application 63/448,585, filed on Feb. 27, 2023.
Int. Cl. G02B 6/42 (2006.01); G02F 1/015 (2006.01)
CPC G02B 6/4295 (2013.01) [G02B 6/4246 (2013.01); G02B 6/428 (2013.01); G02F 1/0157 (2021.01); G02B 6/4245 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A package comprising:
a first die, comprising:
a first photonic transceiver portion;
a first die first interconnect region;
an optical interface (OI);
a first photonic link from the first photonic transceiver portion to the OI;
a second photonic link from the OI to the first photonic transceiver portion;
an analog/mixed-signal die (an AMS die) comprising:
a second photonic transceiver portion;
an AMS die first interconnect region on a first surface of the AMS die electrically and physically coupled with the first die first interconnect region via first electrical interconnects; and
an AMS die second interconnect region on a second surface of the AMS die different than the first surface of the AMS die; and
a general die comprising:
a general die first interconnect region electrically and physically coupled with the second photonic transceiver portion via the AMS die second interconnect region and second electrical interconnects.