US 12,130,306 B2
Module substrate for semiconductor module, semiconductor module and test socket for testing the same
Kwangkyu Bang, Hwaseong-si (KR); Kiljoong Yun, Hwaseong-si (KR); Yun Chang, Hwaseong-si (KR); and Jaegyu Choi, Seongnam-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Aug. 10, 2022, as Appl. No. 17/884,661.
Claims priority of application No. 10-2022-0000171 (KR), filed on Jan. 3, 2022.
Prior Publication US 2023/0213554 A1, Jul. 6, 2023
Int. Cl. G01R 1/04 (2006.01); G01R 31/28 (2006.01)
CPC G01R 1/0466 (2013.01) [G01R 1/0483 (2013.01); G01R 31/2863 (2013.01); G01R 31/2884 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A module substrate for a semiconductor module, comprising:
a wiring substrate having an upper surface and a lower surface opposite to the upper surface, wherein the wiring substrate includes a circuit wiring and a plurality of via holes extending from the upper surface to the lower surface in a thickness direction;
a plurality of test terminals respectively provided on the via holes and electrically connected to the circuit wiring; and
a fastening thin film provided on the wiring substrate and covering the via holes,
wherein the fastening thin film has a predetermined thickness such that a portion of the fastening thin film is penetrated when an interface inspection pin is inserted into the portion of the fastening thin film through the via hole from the upper surface, and the portion of the penetrated fastening thin film holds the penetrating interface inspection pin.