US 12,130,304 B2
Inertial sensor module
Masayasu Sakuma, Shiojiri (JP)
Assigned to SEIKO EPSON CORPORATION, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Sep. 12, 2022, as Appl. No. 17/942,461.
Claims priority of application No. 2021-149174 (JP), filed on Sep. 14, 2021.
Prior Publication US 2023/0078589 A1, Mar. 16, 2023
Int. Cl. G01P 15/18 (2013.01); G01C 19/5776 (2012.01); G01P 1/02 (2006.01); G01P 3/44 (2006.01); G01P 15/08 (2006.01)
CPC G01P 15/18 (2013.01) [G01C 19/5776 (2013.01); G01P 1/023 (2013.01); G01P 3/44 (2013.01); G01P 15/0802 (2013.01); G01P 15/0888 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An inertial sensor module comprising:
a first inertial sensor accommodated within a single package and only having a first axis as a detection axis;
a second inertial sensor having the first axis, a second axis, and a third axis as detection axes;
a printed circuit board having a planar main surface, which is an upper surface of the printed circuit board, on which the first inertial sensor and the second inertial sensor are provided;
a metal cap bonded to the main surface of the printed circuit board such that the first inertial sensor and the second inertial sensor are accommodated between the main surface and the metal cap; and
an operation circuit, which is an integrated circuit device, provided on a lower surface of the printed circuit board, the lower surface of the printed circuit board being opposite to the upper surface, wherein
the first inertial sensor and the second inertial sensor are separated from each other,
detection accuracy of the first inertial sensor is higher than detection accuracy of the second inertial sensor,
the first inertial sensor and the second inertial sensor detect a same physical quantity, and
the first inertial sensor is a quartz crystal sensor and the second inertial sensor includes sensor elements formed of a silicon substrate.