US 12,130,242 B2
Inspection system of semiconductor wafer and method of driving the same
Doyoung Yoon, Suwon-si (KR); Jeongho Ahn, Suwon-si (KR); Dongryul Lee, Suwon-si (KR); Dongchul Ihm, Suwon-si (KR); and Chungsam Jun, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Aug. 9, 2023, as Appl. No. 18/446,837.
Application 18/446,837 is a continuation of application No. 17/501,318, filed on Oct. 14, 2021, granted, now 11,754,510.
Prior Publication US 2023/0384239 A1, Nov. 30, 2023
Int. Cl. G01N 21/95 (2006.01); G01N 21/88 (2006.01); G01N 21/956 (2006.01); H01L 21/66 (2006.01)
CPC G01N 21/9501 (2013.01) [G01N 21/8806 (2013.01); G01N 21/956 (2013.01); H01L 22/12 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of driving an inspection system of a wafer, the method comprising:
synchronizing a cooling controller with an inspection controller;
cooling a wafer chuck by the cooling controller;
cooling a wafer by spraying a cooling gas onto a surface of the wafer disposed on the wafer chuck by the cooling controller;
irradiating the surface of the wafer with light by driving a light source; and
inspecting a pattern formed on the surface of the wafer,
wherein synchronizing the cooling controller with the inspection controller comprises:
generating an inspection control signal for inspecting the pattern of the wafer by the inspection controller and transmitting the inspection control signal to the cooling controller; and
generating a cooling control signal by the cooling controller and transmitting the cooling control signal to the inspection controller.