US 12,130,000 B2
Elongated modular heat sink with coupled light source
Daniel S. Spiro, Scottsdale, AZ (US)
Assigned to EXPOSURE ILLUMINATION ARCHITECTS, INC., Scottsdale, AZ (US)
Filed by Exposure Illumination Architects, Inc., Scottsdale, AZ (US)
Filed on May 15, 2023, as Appl. No. 18/197,104.
Application 18/197,104 is a continuation in part of application No. 17/397,508, filed on Aug. 9, 2021, granted, now 11,680,702.
Application 17/397,508 is a continuation in part of application No. 16/672,218, filed on Nov. 1, 2019, granted, now 11,085,627, issued on Aug. 10, 2021.
Application 16/672,218 is a continuation in part of application No. PCT/US2019/033152, filed on May 20, 2019.
Application PCT/US2019/033152 is a continuation of application No. 16/019,329, filed on Jun. 26, 2018, granted, now 10,502,407, issued on Dec. 10, 2019.
Claims priority of provisional application 62/674,431, filed on May 21, 2018.
Prior Publication US 2023/0280024 A1, Sep. 7, 2023
Int. Cl. F21V 29/74 (2015.01); F21K 9/27 (2016.01); F21V 15/01 (2006.01); F21V 23/00 (2015.01); F21V 23/04 (2006.01); F21V 29/70 (2015.01); F21V 29/77 (2015.01); H05B 45/20 (2020.01); H05B 47/125 (2020.01); F21V 5/04 (2006.01); F21Y 103/10 (2016.01); F21Y 113/10 (2016.01); F21Y 115/10 (2016.01); H01L 33/64 (2010.01)
CPC F21V 29/74 (2015.01) [F21K 9/27 (2016.08); F21V 15/01 (2013.01); F21V 23/003 (2013.01); F21V 23/0478 (2013.01); F21V 29/70 (2015.01); F21V 29/773 (2015.01); H05B 45/20 (2020.01); H05B 47/125 (2020.01); F21V 5/04 (2013.01); F21Y 2103/10 (2016.08); F21Y 2113/10 (2016.08); F21Y 2115/10 (2016.08); H01L 33/642 (2013.01)] 23 Claims
OG exemplary drawing
 
1. An elongated heatsink array comprising:
a first heatsink module and a second heat sink module that are members of an array of heat sink modules and each is unitarily fabricated and displays a solid heatsink core with a longitudinal opening extending from end to end with at least one conductor extending inside from end to end, ends of the at least one conductor couple to a connector that couples to a reciprocating connector disposed on a surface of a device receptacle;
a joiner that aligns and secures the first heatsink module and the second heatsink module;
the device receptacle which is coupled to the joiner and configured to convey at least a portion of power from the first heatsink module to the second heatsink module;
a power supply coupled to a power line source;
a support structure includes a harness and/or a housing and is supported from a structure above, the support housing of the support structure retains the power supply, and at least one of the first heatsink module and the joiner are distally supported mechanically from above by the support structure; and
a power conductor is coupled to the power supply and also coupled to at least one distally located receptacle disposed on a surface of the device receptacle, wherein
a portion of power that enters the first heatsink module is conveyed through the device receptacle to the power supply and the power supply provides power to at least one power consuming device coupled to at least one of the first heatsink module, the second heatsink module or a device receptacle, and
another portion of the power that enters the first heatsink module continues through the device receptacle to at least the second heat sink module.