	US 12,129,338 B2
	Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the same
Changbo Shim, Daejeon (KR); Seunghyun Song, Daejeon (KR); Hwayeon Moon, Daejeon (KR); Hyunsung Min, Daejeon (KR); and Hee Yong Shim, Daejeon (KR)
Assigned to LG Chem, Ltd., Seoul (KR)
Appl. No. 16/957,345
Filed by LG CHEM, LTD., Seoul (KR)
PCT Filed Apr. 9, 2019, PCT No. PCT/KR2019/004222 § 371(c)(1), (2) Date Jun. 23, 2020, PCT Pub. No. WO2019/199032, PCT Pub. Date Oct. 17, 2019.
Claims priority of application No. 10-2018-0041697 (KR), filed on Apr. 10, 2018; application No. 10-2018-0071076 (KR), filed on Jun. 20, 2018; application No. 10-2019-0036078 (KR), filed on Mar. 28, 2019; and application No. 10-2019-0036079 (KR), filed on Mar. 28, 2019.
Prior Publication US 2020/0332056 A1, Oct. 22, 2020
Int. Cl. C08G 73/12 (2006.01); B32B 5/26 (2006.01); B32B 7/027 (2019.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); B32B 27/38 (2006.01); C08G 59/56 (2006.01); C08G 59/68 (2006.01); C08J 5/24 (2006.01); C08K 3/36 (2006.01); C08K 5/5419 (2006.01); C08K 9/06 (2006.01); C08L 33/08 (2006.01); C08L 63/00 (2006.01); C08L 79/08 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01)

CPC C08G 73/12 (2013.01) [B32B 5/26 (2013.01); B32B 7/027 (2019.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 27/38 (2013.01); C08G 59/56 (2013.01); C08G 59/686 (2013.01); C08J 5/244 (2021.05); C08J 5/249 (2021.05); C08K 3/36 (2013.01); C08K 5/5419 (2013.01); C08K 9/06 (2013.01); C08L 33/08 (2013.01); C08L 63/00 (2013.01); C08L 79/08 (2013.01); H01L 23/145 (2013.01); H01L 23/562 (2013.01); H05K 1/0271 (2013.01); H05K 1/0373 (2013.01); B32B 2250/40 (2013.01); B32B 2260/021 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/734 (2013.01); B32B 2457/00 (2013.01); B32B 2457/14 (2013.01); C08J 2363/00 (2013.01); C08J 2433/08 (2013.01); C08J 2479/08 (2013.01); C08K 2201/003 (2013.01); C08K 2201/014 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01); H05K 2201/068 (2013.01)]

10 Claims

1. A thermosetting resin composition for a semiconductor package, comprising:

an aromatic amine compound containing one or more of at least one kind of functional group selected from the group consisting of a sulfone group and a C1 to C20 alkyl group that is unsubstituted or substituted with a halogen group, and having 2 to 5 amine groups,

a thermosetting resin,

a thermoplastic resin comprising a (meth)acrylate-based polymer and having a weight average molecular weight of 500,000 to 800,000, and

an inorganic filler in an amount of 50 to 150 parts by weight of the inorganic filler based on 100 parts by weight of a total amount of the thermosetting resin, the thermoplastic resin and the aromatic amine compound,

wherein the thermosetting resin comprises at least one epoxy resin selected from the group consisting of a bisphenol A type epoxy resin, a phenol novolac epoxy resin, a phenyl aralkyl-based epoxy resin, a tetraphenyl ethane epoxy resin, a naphthalene-based epoxy resin, a biphenyl-based epoxy resin, a dicyclopentadiene epoxy resin and a mixture of a dicyclopentadiene-based epoxy resin and a naphthalene-based epoxy resin,

wherein a glass transition temperature of the thermosetting resin composition after curing is 230° C. or less,

wherein the thermosetting resin is included in an amount of from 150 parts by weight to 300 parts by weight based on 100 parts by weight of the amine compound, and

wherein an equivalent ratio calculated by the following Equation 1 is 1.45 or more:

Equivalent ratio=total active hydrogen equivalent contained in the amine compound/total curable functional group equivalent contained in the thermosetting resin [Equation 1].