US 12,128,729 B2
Integrated optical transceiver
Ding Liang, Westlake Village, CA (US); Mark Patterson, San Jose, CA (US); Roberto Coccioli, Simi Valley, CA (US); and Radhakrishnan L. Nagarajan, Santa Clara, CA (US)
Assigned to Marvell Asia Pte Ltd, Singapore (SG)
Filed by Marvell Asia Pte Ltd, Singapore (SG)
Filed on Oct. 13, 2023, as Appl. No. 18/380,085.
Application 18/380,085 is a continuation of application No. 17/857,397, filed on Jul. 5, 2022, granted, now 11,791,899.
Application 17/857,397 is a continuation of application No. 17/116,737, filed on Dec. 9, 2020, granted, now 11,381,313, issued on Jul. 5, 2022.
Application 17/116,737 is a continuation of application No. 17/033,194, filed on Sep. 25, 2020, granted, now 10,892,830, issued on Jan. 12, 2021.
Application 17/033,194 is a continuation of application No. 16/706,450, filed on Dec. 6, 2019, granted, now 10,826,613, issued on Nov. 3, 2020.
Prior Publication US 2024/0149632 A1, May 9, 2024
Int. Cl. B60G 21/05 (2006.01); B60G 15/02 (2006.01)
CPC B60G 21/05 (2013.01) [B60G 15/02 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An optical transceiver, comprising:
a silicon photonics substrate; and
a plurality of devices configured to process optical signals propagating to and from the optical transceiver, and to perform at least one of an optical-to-electrical conversion of received optical signals to incoming electric signals and an electrical-to-optical conversion of outgoing electric signals to transmitted optical signals, the plurality of devices each being fabricated to include respectively a package substrate configured according to one of a plurality of different package substrate mounting technologies, wherein each package substrate among the plurality of devices is mounted on the silicon photonics substrate according to mounting requirements of the respective package substrate mounting technology of that package substrate, and wherein at least two of the package substrates are mounted according to the mounting requirements of different package substrate mounting technologies.