	US 12,128,704 B2
	Mask exposure method, transparent conductive metallization and pigment
Winfried Hoffmuller, Bad Tolz (DE); Michael Sobol, Munich (DE); and Andreas Rauch, Ohlstadt (DE)
Assigned to GIESECKE+DEVRIENT CURRENCY TECHNOLOGY GMBH, Munich (DE)
Appl. No. 18/263,787
Filed by GIESECKE+DEVRIENT CURRENCY TECHNOLOGY GMBH, Munich (DE)
PCT Filed Jan. 10, 2022, PCT No. PCT/EP2022/025006 § 371(c)(1), (2) Date Aug. 1, 2023, PCT Pub. No. WO2022/161737, PCT Pub. Date Aug. 4, 2022.
Claims priority of application No. 10 2021 000 478.7 (DE), filed on Feb. 1, 2021.
Prior Publication US 2024/0042788 A1, Feb. 8, 2024
Int. Cl. B42D 25/41 (2014.01); B42D 25/373 (2014.01); B42D 25/445 (2014.01)

CPC B42D 25/41 (2014.10) [B42D 25/373 (2014.10); B42D 25/445 (2014.10)]

12 Claims

1. A mask exposure method, comprising the following steps:

providing a carrier substrate;

applying a full-area, radiation-crosslinkable, washable ink layer to the carrier substrate;

irradiating the radiation-crosslinkable, washable ink layer in defined regions by means of a shadow mask, so that washable ink is cured in the defined regions;

applying a full-area metallization;

removing non-irradiated washable ink outside of the defined regions, together with metal present thereon, by means of a solvent, so that the carrier substrate obtained comprises cured washable ink with metal applied thereon only in the defined regions.