US 12,128,679 B2
Capping device and liquid ejecting apparatus
Hiromichi Takanashi, Shiojiri (JP); Akira Yamagishi, Shiojiri (JP); and Akihiro Toya, Shiojiri (JP)
Assigned to SEIKO EPSON CORPORATION, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Aug. 4, 2023, as Appl. No. 18/365,454.
Application 18/365,454 is a division of application No. 17/394,956, filed on Aug. 5, 2021, granted, now 11,807,007.
Claims priority of application No. 2020-134457 (JP), filed on Aug. 7, 2020; application No. 2020-134458 (JP), filed on Aug. 7, 2020; and application No. 2020-189453 (JP), filed on Nov. 13, 2020.
Prior Publication US 2023/0373216 A1, Nov. 23, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B41J 2/165 (2006.01); B41J 2/01 (2006.01)
CPC B41J 2/01 (2013.01) [B41J 2/16505 (2013.01); B41J 2/16508 (2013.01); B41J 2/16585 (2013.01); B41J 2/165 (2013.01); B41J 2/16523 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A liquid ejecting apparatus comprising:
a liquid ejecting head configured to eject a liquid from a nozzle; and
a capping device configured to form a space surrounding an opening of the nozzle, wherein
the capping device includes a cap,
the cap includes:
a recess that forms the space;
a humidifying chamber that has an inlet through which a humidifying fluid for humidifying the space flows in and an outlet through which the humidifying fluid flows out; and
a partition wall, having gas permeability, that restricts passage of the liquid from the recess to the humidifying chamber, and
the recess has a hole for discharging the liquid discharged from the liquid ejecting head.