US 12,128,503 B2
Laser apparatus and laser machining method
Sung Yong Lee, Seongnam-si (KR); Toshinaru Suzuki, Suwon-si (KR); Seung Ho Myoung, Hwaseong-si (KR); Gyeong Hee Han, Yongin-si (KR); and Gyoo Wan Han, Yongin-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed by SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed on Feb. 21, 2023, as Appl. No. 18/111,940.
Application 18/111,940 is a division of application No. 16/862,815, filed on Apr. 30, 2020, granted, now 11,612,964.
Claims priority of application No. 10-2019-0103025 (KR), filed on Aug. 22, 2019.
Prior Publication US 2023/0201969 A1, Jun. 29, 2023
Int. Cl. B23K 26/38 (2014.01); B23K 26/12 (2014.01); B23K 26/70 (2014.01); B23K 101/40 (2006.01)
CPC B23K 26/38 (2013.01) [B23K 26/1224 (2015.10); B23K 26/127 (2013.01); B23K 26/706 (2015.10); B23K 2101/40 (2018.08)] 6 Claims
OG exemplary drawing
 
1. A laser machining method comprising:
arranging a first protection window in a first vacuum chamber, wherein the first vacuum chamber includes a chamber window, and the first protection window overlaps the chamber window;
arranging a first target substrate in the first vacuum chamber;
emitting a laser beam through the chamber window and the first protection window to perform laser machining on the first target substrate;
transferring the first protection window to a second vacuum chamber disposed at a side of the first vacuum chamber; and
transferring a second protection window from the second vacuum chamber to the first vacuum chamber.