US 12,128,494 B2
Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making same
Brent Elliot, Cupertino, CA (US); Guleid Hussen, San Francisco, CA (US); Jason Stephens, San Francisco, CA (US); Michael Parker, Brentwood, CA (US); and Alfred Grant Elliot, Palo Alto, CA (US)
Assigned to Watlow Electric Manufacturing Company, St. Louis, MO (US)
Filed by WATLOW ELECTRIC MANUFACTURING COMPANY, St. Louis, MO (US)
Filed on May 15, 2023, as Appl. No. 18/317,571.
Application 18/317,571 is a continuation of application No. 16/203,562, filed on Nov. 28, 2018, granted, now 11,648,620.
Claims priority of provisional application 62/592,348, filed on Nov. 29, 2017.
Prior Publication US 2023/0278123 A1, Sep. 7, 2023
Int. Cl. C04B 35/581 (2006.01); B23K 1/00 (2006.01); B23K 1/008 (2006.01); B23K 1/19 (2006.01); B23K 35/28 (2006.01); B32B 9/00 (2006.01); C04B 37/00 (2006.01); C04B 37/02 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); B23K 103/00 (2006.01)
CPC B23K 1/0016 (2013.01) [B23K 1/008 (2013.01); B23K 1/19 (2013.01); B23K 35/286 (2013.01); B32B 9/005 (2013.01); C04B 35/581 (2013.01); C04B 37/005 (2013.01); C04B 37/026 (2013.01); H01L 21/67126 (2013.01); H01L 21/6833 (2013.01); H01L 21/68757 (2013.01); H01L 21/68785 (2013.01); H01L 21/68792 (2013.01); B23K 2103/52 (2018.08); C04B 2235/6581 (2013.01); C04B 2237/123 (2013.01); C04B 2237/126 (2013.01); C04B 2237/127 (2013.01); C04B 2237/128 (2013.01); C04B 2237/34 (2013.01); C04B 2237/343 (2013.01); C04B 2237/365 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/68 (2013.01); C04B 2237/708 (2013.01); C04B 2237/72 (2013.01); C04B 2237/80 (2013.01); C04B 2237/84 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method for joining of ceramic pieces, the method comprising:
applying a layer of titanium on a first ceramic piece;
applying a layer of titanium on a second ceramic piece;
applying a layer of nickel on each of the layers of titanium on the first ceramic piece and the second ceramic piece;
applying a layer of nickel phosphorous to each of the layers of nickel on the first ceramic piece and the second ceramic piece;
assembling the first ceramic piece and the second ceramic piece with the layers of titanium, nickel, and nickel phosphorous therebetween;
pressing the layer of nickel phosphorous of the first ceramic piece against the layer of nickel phosphorous of the second ceramic piece;
heating the first ceramic piece and the second ceramic piece, with the layers of titanium, nickel, and nickel phosphorous, to a joining temperature in a vacuum; and
cooling the first ceramic piece and the second ceramic piece, with the layers of titanium, nickel, and nickel phosphorous,
wherein a hermetic seal is formed between the first ceramic piece and the second ceramic piece.