US 12,128,451 B2
Substrate processing system and substrate processing method
Hiroaki Ishii, Kyoto (JP); Junichi Ishii, Kyoto (JP); and Kazuhiro Honsho, Kyoto (JP)
Assigned to SCREEN Holdings Co., Ltd., (JP)
Filed by SCREEN Holdings Co., Ltd., Kyoto (JP)
Filed on Dec. 17, 2021, as Appl. No. 17/553,869.
Claims priority of application No. 2020-219355 (JP), filed on Dec. 28, 2020.
Prior Publication US 2022/0203409 A1, Jun. 30, 2022
Int. Cl. B05D 3/00 (2006.01); B08B 3/02 (2006.01); B08B 13/00 (2006.01)
CPC B08B 3/022 (2013.01) [B08B 13/00 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A substrate processing system comprising:
a first substrate holding unit which includes a first base that faces from below a substrate having a protected target surface and a cleaning target surface on the opposite side of the protected target surface and holds the substrate in a first posture in which the protected target surface is facing upward;
a protective film coating nozzle which coats a protective film at least at a peripheral edge portion of the protected target surface of the substrate that is held by the first substrate holding unit;
a first turning unit which turns around the substrate while in contact with a peripheral edge portion of the substrate so that the posture of the substrate can be changed from the first posture to a second posture in which the protected target surface is facing downward;
a second substrate holding unit which includes a second base that faces the substrate from below and holds the substrate in the second posture; and
a cleaning unit which cleans the cleaning target surface of the substrate that is held by the second substrate holding unit, wherein the protective film coating nozzle is configured so as to coat the protective film on the entirety of the protected target surface of the substrate, and the second substrate holding unit includes a second suctioning/holding unit in which a central portion of the protected target surface is suctioned by the second base to hold the substrate.