US 12,128,436 B1
Air-atomizing electrostatic spray system
Steven Craig Cooper, Athens, GA (US); Dae-Woong Kim, Suwanee, GA (US); John Daniel Stevens, Oxford, GA (US); Joshua Daniel Petty, Bethlehem, GA (US); and Bradford A. Range, Dacula, GA (US)
Assigned to ECLIPSE VENTURE, LLC, Lewes, DE (US)
Filed by Electrostatic Spray Innovations, LLC, Athens, GA (US)
Filed on Dec. 17, 2021, as Appl. No. 17/554,965.
Claims priority of provisional application 63/128,425, filed on Dec. 21, 2020.
Int. Cl. B05B 5/03 (2006.01); B05B 5/00 (2006.01); B05B 5/043 (2006.01); B05B 5/053 (2006.01); B05B 5/16 (2006.01)
CPC B05B 5/032 (2013.01) [B05B 5/001 (2013.01); B05B 5/043 (2013.01); B05B 5/0533 (2013.01); B05B 5/1691 (2013.01)] 39 Claims
OG exemplary drawing
 
1. A spray system, comprising:
a spray device with a spray housing that encloses an electrostatic power supply configured to generate an electrostatic charging voltage and a nozzle assembly including a liquid tip configured to receive a spray liquid and an air stream and atomize the spray liquid to emit an atomized spray at a spray outlet and further including an electrostatic charging electrode electrically coupled to receive the electrostatic charging voltage and configured to inductively charge the atomized spray;
a base unit that includes a liquid source configured to supply the spray liquid, an air source configured to supply the air stream and a power source circuit configured to generate a supply power for the electrostatic power supply; and
a tether coupling the spray device to the base unit, wherein said tether includes a liquid supply line coupling the liquid source to the liquid tip, an air supply line coupling the air source to the liquid tip, and a power supply line coupling the power source circuit to the electrostatic power supply;
a liquid grounding element in a liquid tube coupled to supply the spray liquid to said liquid tip, wherein said liquid grounding element is electrically coupled to a low voltage side of the electrostatic power supply;
wherein the spray housing includes a portion made of a semiconductive material and wherein said portion is electrically coupled to said low voltage side of the electrostatic power supply; and
an electrical grounding connection of said low voltage side of the electrostatic power supply to ground.