US 12,128,401 B2
Microfluidic module and method of fabricating the microfluidic module
Taesung Kim, Ulsan (KR); and Juyeol Bae, Ulsan (KR)
Assigned to UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY), Ulsan (KR)
Filed by UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY), Ulsan (KR)
Filed on Sep. 19, 2022, as Appl. No. 17/947,207.
Claims priority of application No. 10-2021-0126358 (KR), filed on Sep. 24, 2021.
Prior Publication US 2023/0095313 A1, Mar. 30, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B29C 33/38 (2006.01); B01L 3/00 (2006.01); B29C 33/52 (2006.01); B81C 1/00 (2006.01); B29K 83/00 (2006.01)
CPC B01L 3/502707 (2013.01) [B29C 33/3842 (2013.01); B29C 33/52 (2013.01); B81C 1/00119 (2013.01); B01L 2300/0874 (2013.01); B29K 2083/00 (2013.01); B81C 2201/0108 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method of fabricating a microfluidic module, the method comprising:
fabricating a basic mold, the basic mold comprising a base member, a first base groove formed on the base member to extend in a longitudinal direction and having a storage space therein, a second base groove formed on the base member, being spaced apart from the first base groove and having a storage space therein, and a third base groove formed between the first base groove and the second base groove so that the first base groove and the second base groove communicate with each other;
fabricating a master mold that is repeatedly usable by using the basic mold as a template;
fabricating a first microfluidic film by using the master mold as a template, the first microfluidic film comprising a first microchannel through which a fluid flows and a first through passage for communicating with the microfluidic film stacked on an upper portion or a lower portion of the first microchannel;
fabricating a second microfluidic film by using the master mold as a template, the second microfluidic film comprising a second microchannel through which a fluid flows and a second through passage for communicating with the first through passage or the first microchannel; and
aligning the second microfluidic film on the first microfluidic film and attaching the second microfluidic film to the first microfluidic film so that the first through passage communicates with the second through passage or the second microchannel;
wherein the fabricating of the basic mold comprises:
a first exposure operation in which a first photoresist is applied onto a wafer, a first mask having a first pattern corresponding to a connection channel through which the microchannel and the through passage communicate with each other, is disposed at an upper portion of the first photoresist and light is irradiated to the first mask;
a first etching exposure operation in which the wafer that has undergone the first exposure operation is etched by using a developing agent;
a second exposure operation in which, after the first photoresist is removed, a second photoresist is applied onto the wafer, a second mask having a second pattern corresponding to the through passage is disposed at an upper portion of the second photoresist and light is irradiated onto the second mask;
a second etching operation in which the wafer that has undergone the second exposure operation is etched by using a developing agent;
a third exposure operation in which, after the second photoresist is removed, a third photoresist is applied onto the wafer, a third mask having a third pattern formed at a position corresponding to the microchannel and a fourth pattern being spaced apart from the third pattern, being formed at a position corresponding to the second pattern of the second mask and having a greater width than a width of the second pattern of the second mask is disposed at an upper portion of the third photoresist and light is irradiated onto the third mask; and
a third etching operation in which the wafer that has undergone the third exposure operation is etched by using a developing agent.