US 12,127,832 B2
Wearable devices with integrated circuitry
Ankita Singh, Hudson, MA (US); Raymond O. England, East Greenwich, RI (US); and Shawn Prevoir, Northborough, MA (US)
Assigned to Bose Corporation, Framingham, MA (US)
Filed by Bose Corporation, Framingham, MA (US)
Filed on Oct. 31, 2018, as Appl. No. 16/176,859.
Prior Publication US 2020/0129102 A1, Apr. 30, 2020
Int. Cl. A61B 5/1455 (2006.01); A61B 5/00 (2006.01); A61B 5/024 (2006.01)
CPC A61B 5/14551 (2013.01) [A61B 5/0002 (2013.01); A61B 5/02416 (2013.01); A61B 5/486 (2013.01); A61B 5/6802 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of fabricating a wearable device having one or more integrated electronic components, comprising the steps of: providing a substrate comprising the steps of compounding an elastomeric material made of an elastomer with at least one metal oxide additive in a ratio, wherein the elastomeric material comprises a durometer equal to or less than 80 Shore A and curing or molding the compounded material to form the substrate, and wherein a percent by weight of the at least one metal oxide additive is at least 20%; forming electrical circuitry comprising at least one plating layer of the at least one metal oxide additive within the elastomeric material made of the elastomer of the substrate by structuring one or more electrically conductive traces and plating the one or more electrically conductive traces; and providing the electrical circuitry with a physiological electrode sensor, wherein the physiological electrode sensor is configured to come in direct contact with skin of an individual and apply pressure to a position on the individual.