CPC A45C 13/1069 (2013.01) [A45C 11/00 (2013.01); H01F 7/02 (2013.01); H04R 1/1091 (2013.01); H05K 5/03 (2013.01); A45C 2011/001 (2013.01)] | 19 Claims |
1. An enclosure configured to receive an electronic device, comprising:
a bendable layer that is configured to open and close and that has first and second portions; and
a magnetic clasp formed from a magnet in the second portion of the bendable layer, wherein the bendable layer comprises a polymer base layer and first and second covering layers, wherein the magnet comprises a flexible magnet embedded in the polymer base layer, wherein the polymer base layer with the embedded flexible magnet is interposed between the first and second covering layers, wherein the second portion of the bendable layer folds about a fold axis and covers the first portion of the bendable layer in a closed state of the enclosure, and wherein the second portion of the bendable layer is unfolded about the fold axis in an open state of the enclosure.
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