| CPC H10K 59/131 (2023.02) [H10K 71/00 (2023.02); H10K 59/1201 (2023.02)] | 6 Claims |

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1. A method of manufacturing a display apparatus, the method comprising:
preparing a display panel including a first line and a first integration pad, wherein the first line has a first height and is disposed on an upper surface of a substrate in a non-display region outside a display region of the substrate, and the first integration pad is connected to an end of the first line and has a width greater than a width of the first line;
preparing a flexible printed circuit board including a second line on a lower surface thereof, wherein the second line has a second height;
disposing the flexible printed circuit board and the substrate in a way such that an upper surface of the first integration pad and a lower surface of the second line are in contact with each other;
bonding the first integration pad and the second line to each other; and
forming, by radiating a laser beam onto the first integration pad, a first opening and a second opening through the first integration pad in a thickness direction to extend along one side of the second line and another side of the second line from a first end of the first integration pad in a direction to the first line to a second end of the first integration pad in a direction away from the first line.
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