US 12,457,836 B2
Manufacturing method of an electronic device
Jia-Yuan Chen, Miao-Li County (TW); Tsung-Han Tsai, Miao-Li County (TW); Kuan-Feng Lee, Miao-Li County (TW); and Yuan-Lin Wu, Miao-Li County (TW)
Assigned to INNOLUX CORPORATION, Miao-Li County (TW)
Filed by InnoLux Corporation, Miao-Li County (TW)
Filed on May 28, 2024, as Appl. No. 18/675,750.
Application 18/675,750 is a continuation of application No. 17/551,409, filed on Dec. 15, 2021, granted, now 12,021,179.
Application 17/551,409 is a continuation of application No. 16/783,397, filed on Feb. 6, 2020, granted, now 11,227,984, issued on Jan. 18, 2022.
Application 16/783,397 is a continuation of application No. 16/013,074, filed on Jun. 20, 2018, granted, now 10,593,852, issued on Mar. 17, 2020.
Prior Publication US 2024/0313187 A1, Sep. 19, 2024
Int. Cl. H01L 33/62 (2010.01); H01L 25/13 (2006.01); H10H 20/812 (2025.01); H10H 20/851 (2025.01); H10H 20/855 (2025.01); H10H 20/857 (2025.01); H01L 23/488 (2006.01); H01L 23/49 (2006.01); H01L 25/075 (2006.01)
CPC H10H 20/857 (2025.01) [H01L 25/13 (2013.01); H10H 20/812 (2025.01); H10H 20/8514 (2025.01); H10H 20/855 (2025.01); H01L 23/488 (2013.01); H01L 23/49 (2013.01); H01L 25/0753 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A manufacturing method of an electronic device, comprising:
providing a substrate;
providing a plurality of signal lines on the substrate;
providing a first pad on the substrate;
providing a second pad on the substrate;
providing a connecting layer between the substrate and the first pad and between the substrate and the second pad;
providing a passivation layer between the substrate and the connecting layer and having a via, wherein the connecting layer is electrically connected to one of the plurality of signal lines through the via, and the first pad is electrically connected to the one of the plurality of signal lines through the connecting layer;
providing a first electronic component comprising a first electrode, wherein the first electrode is electrically connected to the first pad;
removing the first electronic component from the substrate when the first electronic component is dysfunctional; and
providing a second electronic component on the substrate and electrically connected to the second pad, wherein the second pad is electrically connected to the one of the plurality of signal lines through the connecting layer.