| CPC H10H 20/857 (2025.01) [H01L 25/0753 (2013.01)] | 19 Claims | 

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               1. A light module, comprising: 
            a substrate including first pads; 
                a first light emitting device disposed on the substrate and including a pad; 
                a second light emitting device disposed on the substrate and including a pad; 
                a metal bonding layer connecting the pad of the first light emitting device to one of the first pads; and 
                an adhesive layer covering the pad of the first light emitting device and the pad of the second light emitting device, 
                wherein a region between the first light emitting device and the second light emitting device is filled with the adhesive layer, 
                wherein the adhesive layer includes a first region and a second region, the first region of the adhesive layer includes an insulation matrix, and the second region of the adhesive layer includes balls, 
                wherein the balls include a metal material, and 
                wherein an upper surface of the first light emitting device is placed higher than an upper surface of the second light emitting device. 
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