| CPC H10H 20/857 (2025.01) [H01L 25/0753 (2013.01); H10H 20/01 (2025.01); H10H 20/0364 (2025.01)] | 20 Claims |
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1. An electronic device comprising:
a plurality of substrate electrodes on a substrate, the substrate electrodes including initial electrodes and spare electrodes;
a bonding material covering the initial electrodes and the spare electrodes;
module structures respectively provided on first initial electrodes of the initial electrodes; and
solders between each of the first initial electrodes and each of the module structures,
wherein the spare electrodes comprise second spare electrodes,
wherein the module structures are not provided on the second spare electrodes,
wherein the bonding material on the first initial electrodes is harder than the bonding material on the second spare electrodes.
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