US 12,457,809 B2
Imaging systems with image sensors having multiple radiation detectors
Peiyan Cao, Shenzhen (CN); and Yurun Liu, Shenzhen (CN)
Assigned to SHENZHEN XPECTVISION TECHNOLOGY CO., LTD., Shenzhen (CN)
Filed by SHENZHEN XPECTVISION TECHNOLOGY CO., LTD., Shenzhen (CN)
Filed on Aug. 30, 2023, as Appl. No. 18/239,970.
Application 18/239,970 is a continuation of application No. PCT/CN2021/082514, filed on Mar. 24, 2021.
Prior Publication US 2023/0411433 A1, Dec. 21, 2023
Int. Cl. H10F 39/18 (2025.01); G01T 1/24 (2006.01)
CPC H10F 39/1895 (2025.01) [G01T 1/24 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An imaging system, comprising:
an image sensor which comprises:
a system printed circuit board (system PCB);
M group printed circuit boards (group PCBs (i), i=1, . . . , M) mounted on a mounting surface of the system PCB; and
Ni radiation detectors mounted on the group PCB (i), for i=1, . . . , M,
wherein M and Ni are integers greater than 1,
wherein the image sensor is configured to scan a scene in a scanning direction, and
wherein, for each group PCB (i), there is not a plane which (A) is parallel to a normal direction of the mounting surface of the system PCB, (B) is parallel to the scanning direction, (C) divides all active areas of the Ni radiation detectors into 2 groups of active areas, and (D) does not intersect any active area of all the active areas of the Ni radiation detectors.