US 12,457,808 B2
Photon detector array assembly
Eduardo Bartolome, Dallas, TX (US); and Rakul Viswanath, Bangalore (IN)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on May 5, 2023, as Appl. No. 18/312,948.
Application 18/312,948 is a division of application No. 16/884,812, filed on May 27, 2020, granted, now 11,682,745.
Prior Publication US 2023/0275176 A1, Aug. 31, 2023
Int. Cl. H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H10F 30/00 (2025.01); H10F 30/10 (2025.01); H10F 39/00 (2025.01); H10F 39/18 (2025.01); H10F 71/00 (2025.01)
CPC H10F 30/10 (2025.01) [H01L 21/4846 (2013.01); H01L 21/568 (2013.01); H01L 24/19 (2013.01); H10F 30/301 (2025.01); H10F 39/182 (2025.01); H10F 39/184 (2025.01); H10F 39/189 (2025.01); H10F 39/809 (2025.01); H10F 39/811 (2025.01); H10F 71/00 (2025.01)] 35 Claims
OG exemplary drawing
 
1. A method, comprising:
attaching read out integrated circuit (ROIC) dies and through leads on a substrate;
filling spaces on the substrate with a mold compound;
forming a first layer on the ROIC dies, the through leads, and the mold compound, the first layer including a dielectric layer and conductors that couple bond pads of the ROIC dies to signal input pads on the first layer;
forming conductive members on the signal input pads;
removing the substrate; and
cutting through the first layer and the mold compound to form die carriers, wherein each die carrier includes at least one of the ROIC dies and one or more of the through leads and wherein a pitch of the conductors in the first layer close to the ROIC dies is smaller than a pitch of the conductors in the first layer close to the signal input pads.