US 12,457,766 B2
Metal gate structures of semiconductor devices
Chung-Liang Cheng, Changhua County (TW); and Ziwei Fang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Feb. 28, 2022, as Appl. No. 17/683,260.
Application 17/683,260 is a division of application No. 16/718,862, filed on Dec. 18, 2019, granted, now 11,264,503.
Prior Publication US 2022/0190153 A1, Jun. 16, 2022
Int. Cl. H10D 30/62 (2025.01); H10D 30/01 (2025.01); H10D 62/10 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 84/83 (2025.01)
CPC H10D 30/62 (2025.01) [H10D 30/024 (2025.01); H10D 62/118 (2025.01); H10D 84/0128 (2025.01); H10D 84/0144 (2025.01); H10D 84/0158 (2025.01); H10D 84/038 (2025.01); H10D 84/834 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A device, comprising:
first and second stacks of first and second nanostructured layers arranged in an alternating configuration on a substrate;
first and second epitaxial regions of opposite conductivity type on the first and second stacks, respectively;
first and second nanostructured channel regions in the first nanostructured layers of the first and second stacks, respectively; and
first and second gate-all-around (GAA) structures wrapped around each of the first and second nanostructured channel regions, respectively, wherein the first and second GAA structures comprise:
first and second gate dielectric layers wrapped around the first and second nanostructured channel regions, respectively;
first and second gate barrier layers disposed on the first and second gate dielectric layers, respectively, the first and second gate barrier layers having similar material compositions and different work function values and doping concentrations from one another; and
first and second diffusion barrier layers on the first and second gate barrier layers, respectively, the first diffusion barrier layer being thicker than the second diffusion barrier layer.