US 12,457,756 B2
3D printed semiconductor package
Benjamin Stassen Cook, Los Gatos, CA (US); and Daniel Lee Revier, Garland, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Jan. 4, 2024, as Appl. No. 18/404,496.
Application 18/404,496 is a division of application No. 17/163,766, filed on Feb. 1, 2021, granted, now 11,869,925.
Application 17/163,766 is a division of application No. 16/236,106, filed on Dec. 28, 2018, granted, now 10,910,465, issued on Feb. 2, 2021.
Prior Publication US 2024/0145526 A1, May 2, 2024
Int. Cl. H10D 1/20 (2025.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01)
CPC H10D 1/20 (2025.01) [H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/66 (2013.01); H01L 2223/6677 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit comprising:
a substrate;
a semiconductor die on the substrate; and
a device on the semiconductor die and electrically coupled to the semiconductor die, in which the semiconductor die is between the device and the substrate, and the device includes a polymer structure coated with a metal.