US 12,457,721 B2
Systems and methods for power module for inverter for electric vehicle
Kevin M. Gertiser, Carmel, IN (US); and Chris Fruth, Kokomo, IN (US)
Assigned to BORGWARNER US TECHNOLOGIES LLC, Wilmington, DE (US)
Filed by BorgWarner US Technologies LLC, Wilmington, DE (US)
Filed on Jun. 29, 2023, as Appl. No. 18/344,379.
Claims priority of provisional application 63/378,601, filed on Oct. 6, 2022.
Claims priority of provisional application 63/377,486, filed on Sep. 28, 2022.
Claims priority of provisional application 63/377,501, filed on Sep. 28, 2022.
Claims priority of provisional application 63/377,512, filed on Sep. 28, 2022.
Prior Publication US 2024/0106354 A1, Mar. 28, 2024
Int. Cl. H02M 7/5387 (2007.01); B60L 3/00 (2019.01); B60L 15/00 (2006.01); B60L 15/08 (2006.01); B60L 50/40 (2019.01); B60L 50/51 (2019.01); B60L 50/60 (2019.01); B60L 50/64 (2019.01); B60L 53/20 (2019.01); B60L 53/22 (2019.01); B60L 53/62 (2019.01); B60R 16/02 (2006.01); G01R 15/20 (2006.01); G06F 1/08 (2006.01); G06F 13/40 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/15 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01); H01L 23/495 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/07 (2006.01); H02J 7/00 (2006.01); H02M 1/00 (2006.01); H02M 1/08 (2006.01); H02M 1/084 (2006.01); H02M 1/088 (2006.01); H02M 1/12 (2006.01); H02M 1/32 (2007.01); H02M 1/42 (2007.01); H02M 1/44 (2007.01); H02M 3/335 (2006.01); H02M 7/00 (2006.01); H02M 7/537 (2006.01); H02M 7/5395 (2006.01); H02P 27/06 (2006.01); H02P 27/08 (2006.01); H02P 29/024 (2016.01); H02P 29/68 (2016.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 5/02 (2006.01); H05K 7/20 (2006.01); H10D 64/01 (2025.01); B60L 15/20 (2006.01); H03K 19/20 (2006.01)
CPC H02M 7/5387 (2013.01) [B60L 3/003 (2013.01); B60L 15/007 (2013.01); B60L 15/08 (2013.01); B60L 50/40 (2019.02); B60L 50/51 (2019.02); B60L 50/60 (2019.02); B60L 50/64 (2019.02); B60L 53/20 (2019.02); B60L 53/22 (2019.02); B60L 53/62 (2019.02); B60R 16/02 (2013.01); G01R 15/20 (2013.01); G06F 1/08 (2013.01); G06F 13/4004 (2013.01); H01L 21/4882 (2013.01); H01L 23/15 (2013.01); H01L 23/3672 (2013.01); H01L 23/3675 (2013.01); H01L 23/3735 (2013.01); H01L 23/4006 (2013.01); H01L 23/467 (2013.01); H01L 23/473 (2013.01); H01L 23/49562 (2013.01); H01L 23/5383 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H02J 7/0063 (2013.01); H02M 1/0009 (2021.05); H02M 1/0054 (2021.05); H02M 1/08 (2013.01); H02M 1/084 (2013.01); H02M 1/088 (2013.01); H02M 1/123 (2021.05); H02M 1/32 (2013.01); H02M 1/322 (2021.05); H02M 1/327 (2021.05); H02M 1/4258 (2013.01); H02M 1/44 (2013.01); H02M 3/33523 (2013.01); H02M 7/003 (2013.01); H02M 7/537 (2013.01); H02M 7/53871 (2013.01); H02M 7/53875 (2013.01); H02M 7/5395 (2013.01); H02P 27/06 (2013.01); H02P 27/08 (2013.01); H02P 27/085 (2013.01); H02P 29/024 (2013.01); H02P 29/027 (2013.01); H02P 29/68 (2016.02); H05K 1/145 (2013.01); H05K 1/181 (2013.01); H05K 1/182 (2013.01); H05K 5/0247 (2013.01); H05K 7/20154 (2013.01); H05K 7/2039 (2013.01); H05K 7/2049 (2013.01); H05K 7/20854 (2013.01); H05K 7/209 (2013.01); H05K 7/20927 (2013.01); H10D 64/018 (2025.01); B60L 15/20 (2013.01); B60L 2210/30 (2013.01); B60L 2210/40 (2013.01); B60L 2210/42 (2013.01); B60L 2210/44 (2013.01); B60L 2240/36 (2013.01); G06F 2213/40 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4087 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H02J 2207/20 (2020.01); H02P 2207/05 (2013.01); H03K 19/20 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10166 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system comprising:
an inverter configured to convert DC power to AC power, wherein the inverter includes:
a power module including:
a flex layer including a gate trace,
a first substrate,
a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the gate trace of the flex layer to a gate input connection of the power module,
a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to at an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and
a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate;
a battery configured to supply the DC power to the inverter; and
a motor configured to receive the AC power from the inverter to drive the motor.