US 12,457,715 B2
Power module and manufacturing method thereof, power converter, and power supply device
Yibo Wang, Shanghai (CN); Wengang Luo, Shanghai (CN); and Yunfei Qiao, Shanghai (CN)
Assigned to HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by Huawei Digital Power Technologies Co., Ltd., Shenzhen (CN)
Filed on Mar. 24, 2023, as Appl. No. 18/189,692.
Claims priority of application No. 202210304634.0 (CN), filed on Mar. 26, 2022.
Prior Publication US 2023/0309276 A1, Sep. 28, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/209 (2013.01) [H05K 7/20409 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A power module, comprising:
a housing, comprising:
a main housing having a groove and a first outer surface, wherein a groove opening of the groove is located on the first outer surface;
a heat sink located on a side of the housing away from the groove opening; and
a fastening layer disposed on a bottom surface of the groove, wherein a first width of the groove opening is less than a second width of the bottom surface;
a circuit component accommodated in the groove and comprising:
a heat dissipation surface fastened to the fastening layer; and
a pin comprising a distal end extending out of the first outer surface, wherein the pin extends in a direction away from the fastening layer; and
a package configured to cover the circuit component and to at least partially expose the distal end of the pin, wherein the package is filled in the groove.