US 12,457,710 B2
Heat dissipation holder
Jhih-Wei Rao, Taipei (TW); Zih-Siang Huang, Taipei (TW); Hung-Chieh Wu, Taipei (TW); and Liang-Jen Lin, Taipei (TW)
Assigned to ASUSTEK COMPUTER INC., Taipei (TW)
Filed by ASUSTEK COMPUTER INC., Taipei (TW)
Filed on Jan. 13, 2023, as Appl. No. 18/154,519.
Claims priority of application No. 111124983 (TW), filed on Jul. 4, 2022.
Prior Publication US 2024/0008227 A1, Jan. 4, 2024
Int. Cl. F25B 21/02 (2006.01); H05K 7/20 (2006.01); H04M 1/02 (2006.01)
CPC H05K 7/2039 (2013.01) [F25B 21/02 (2013.01); H05K 7/20145 (2013.01); H04M 1/0202 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A heat dissipation holder, applied to a handheld electronic device, the heat dissipation holder comprising:
a base, comprising a first side and a second side that are opposite to each other and a front surface and a rear surface that are opposite to each other, wherein the first side comprises a first opening;
a cover, combined onto the front surface to form an accommodating space with the base, wherein the cover comprises an air inlet region;
a heat dissipation module, disposed in the accommodating space; and
an air guiding structure, disposed on the cover and extending to the first opening, wherein
wherein the first opening, the air inlet region, and the air guiding structure form an airflow channel between the heat dissipation module and the cover, and
wherein the cover comprises a second opening, the air guiding structure is disposed in the second opening, the cover is made of an opaque material, and at least a part of the air guiding structure is made of a translucent material.