US 12,457,700 B2
Removable OCP module with PCIe slots
Chui Ching Chiu, Taoyuan (TW); Chih-Wei Chiang, Taoyuan (TW); and Hsueh-Yu Chao, Taipei (TW)
Assigned to Hewlett Packard Enterprise Development LP, Spring, TX (US)
Filed by HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, Spring, TX (US)
Filed on Feb. 15, 2024, as Appl. No. 18/442,583.
Prior Publication US 2025/0267815 A1, Aug. 21, 2025
Int. Cl. G06F 1/16 (2006.01); G06F 1/18 (2006.01); H05K 1/18 (2006.01); H05K 5/00 (2025.01); H05K 7/00 (2006.01); H05K 7/10 (2006.01)
CPC H05K 7/1092 (2013.01) [G06F 1/185 (2013.01); H05K 1/18 (2013.01); H05K 7/103 (2013.01); H05K 2201/09027 (2013.01); H05K 2201/10189 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A removable module for a computing system, wherein the removable module comprises:
a printed circuit board (PCB) having an open compute project (OCP) network interface controller (NIC) form factor;
an OCP edge connector comprising a plurality of pins on an edge of the PCB, wherein the OCP edge connector is configured to mate with an OCP board connector of a primary system board of the computing system in an installed state of the removable module in the computing system;
a NIC chip mounted to the PCB and communicably connected to the OCP edge connector;
at least one communication port mounted to the PCB and communicably connected to the NIC chip; and
a first PCIe slot mounted on the PCB and communicably connected to the OCP edge connector;
wherein the NIC chip and the first PCIe slot are configured to be communicably connected to the primary system board via the OCP edge connector and OCP board connector in the installed state of the removable module.