US 12,457,694 B2
Multilayer circuit board manufacturing apparatus and multilayer circuit board manufacturing method
Sang Min Lee, Gyeongsangnam-do (KR)
Assigned to HAESUNG DS CO., LTD., Gyeongsangnam-Do (KR)
Filed by HAESUNG DS CO., LTD., Gyeongsangnam-do (KR)
Filed on Sep. 26, 2022, as Appl. No. 17/935,340.
Claims priority of application No. 10-2021-0130305 (KR), filed on Sep. 30, 2021.
Prior Publication US 2023/0095254 A1, Mar. 30, 2023
Int. Cl. H05K 3/46 (2006.01)
CPC H05K 3/4611 (2013.01) [H05K 2203/068 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A multilayer circuit board manufacturing apparatus comprising:
a plurality of uncoilers configured to supply a plurality of different members; and
a compressing machine configured to bond the members, which are supplied from the respective uncoilers, to each other,
wherein the compressing machine comprises:
a belt that rotates in contact with one surface of one of the plurality of members; and
a pressing device including a fluid pressing unit configured to supply a fluid pressure on the belt, the fluid pressing unit being disposed inside the belt and spaced apart from the belt, and the fluid pressure presses the belt opposite from and toward the member in a non-contact manner.