US 12,457,692 B2
Semiconductor device having an insulating portion with a top smaller in width than a diameter of a conductive particle, display device, image capturing device, and electronic apparatus
Hidemasa Oshige, Kanagawa (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Apr. 14, 2022, as Appl. No. 17/720,558.
Claims priority of application No. 2021-069265 (JP), filed on Apr. 15, 2021.
Prior Publication US 2022/0336549 A1, Oct. 20, 2022
Int. Cl. H05K 3/32 (2006.01); H10K 59/121 (2023.01); H10K 59/65 (2023.01); H10K 59/80 (2023.01); H10K 59/131 (2023.01)
CPC H05K 3/323 (2013.01) [H10K 59/1213 (2023.02); H10K 59/65 (2023.02); H10K 59/873 (2023.02); H10K 59/879 (2023.02); H10K 59/131 (2023.02)] 18 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a first substrate;
a functional element arranged on a main surface of the first substrate;
a terminal connected to an electrode electrically connected to the functional element and arranged on a second substrate different from the first substrate;
an insulating portion configured to cover an end of the terminal; and
a conductive film arranged on the terminal and the insulating portion and containing a conductive particle,
wherein in a cross-section of the semiconductor device perpendicular to the main surface of the first substrate, the insulating portion includes a top and lateral sides inclined with respect to the top, and a width of the top is smaller than a diameter of the conductive particle.