US 12,457,688 B2
Electronic module, electronic apparatus, and method of manufacturing the electronic module
Noritake Tsuboi, Kanagawa (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Oct. 31, 2023, as Appl. No. 18/498,080.
Claims priority of application No. 2022-176322 (JP), filed on Nov. 2, 2022; and application No. 2023-169939 (JP), filed on Sep. 29, 2023.
Prior Publication US 2024/0147624 A1, May 2, 2024
Int. Cl. H05K 1/18 (2006.01); H01L 25/16 (2023.01); H05K 3/34 (2006.01)
CPC H05K 1/181 (2013.01) [H01L 25/16 (2013.01); H05K 3/3436 (2013.01); H05K 3/3442 (2013.01); H05K 3/3485 (2020.08); H05K 2201/10015 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/0465 (2013.01)] 34 Claims
OG exemplary drawing
 
1. An electronic module comprising:
a first wiring component including a first pad, a second pad, and a first insulating member configured to define the first pad and the second pad, the first pad, the second pad, and the first insulating member being formed in a first mounting surface;
a first electronic component including a first electrode and a second electrode and being surface-mounted on the first mounting surface;
a first bonding member configured to bond the first pad and the first electrode together; and
a second bonding member configured to bond the second pad and the second electrode together;
wherein the first electrode and the second electrode are positioned on an insulating area of the first mounting surface, the insulating area being formed by the first insulating member, and
wherein a distance between the first electrode and the first insulating member is smaller than a distance between the first electrode and the first pad.