US 12,457,687 B2
Stacked component array structure
Jin Zhao, San Jose, CA (US); Satyan Chandra, Mountain View, CA (US); and Shishuang Sun, San Jose, CA (US)
Assigned to Tesla, Inc., Austin, TX (US)
Appl. No. 18/255,853
Filed by Tesla, Inc., Austin, TX (US)
PCT Filed Dec. 14, 2021, PCT No. PCT/US2021/072923
§ 371(c)(1), (2) Date Jun. 2, 2023,
PCT Pub. No. WO2022/133448, PCT Pub. Date Jun. 23, 2022.
Claims priority of provisional application 63/127,018, filed on Dec. 17, 2020.
Prior Publication US 2024/0015887 A1, Jan. 11, 2024
Int. Cl. H05K 1/11 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01)
CPC H05K 1/113 (2013.01) [H05K 3/328 (2013.01); H05K 3/3436 (2013.01); H05K 3/3442 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/101 (2013.01); H05K 2203/107 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A stacked Printed Circuit Board (PCB) electronic component array structure comprising:
a first PCB;
a second PCB, the second PCB being stacked with the first PCB; and
an electronic component array comprising a plurality of electronic components positioned between the first PCB and the second PCB, the electronic component array comprising a plurality of capacitors, the plurality of electronic components being electrically coupled to the first PCB by way of a first conductive strip connections and being electrically coupled to the second PCB by way of second conductive strip connections, wherein a first conductive strip connection of the first conductive strip connections provides a shared electrical connection between a group of capacitors of the plurality of capacitors and the first PCB.