US 12,457,686 B2
Roughened copper foil, copper-cladded laminate board, and printed wiring board
Ayumu Tateoka, Nantou (TW); Ryosuke Kaneyama, Nantou (TW); Yasuji Hara, Ageo (JP); Yasuo Sato, Ageo (JP); Shinichi Obata, Ageo (JP); and Chun Chieh Li, Nantou (TW)
Assigned to MITSUI MINING & SMELTING CO., LTD., Tokyo (JP)
Appl. No. 18/284,602
Filed by MITSUI MINING & SMELTING CO., LTD., Tokyo (JP)
PCT Filed Mar. 17, 2022, PCT No. PCT/JP2022/012432
§ 371(c)(1), (2) Date Sep. 28, 2023,
PCT Pub. No. WO2022/209989, PCT Pub. Date Oct. 6, 2022.
Claims priority of application No. 2021-056019 (JP), filed on Mar. 29, 2021.
Prior Publication US 2024/0172359 A1, May 23, 2024
Int. Cl. H05K 1/09 (2006.01); C25D 1/04 (2006.01); C25D 3/38 (2006.01); C25D 5/00 (2006.01); H05K 3/18 (2006.01)
CPC H05K 1/09 (2013.01) [C25D 1/04 (2013.01); C25D 3/38 (2013.01); C25D 5/605 (2020.08); H05K 3/18 (2013.01); H05K 2201/0355 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A roughened copper foil comprising a roughened surface on at least one side,
wherein the roughened surface has a roughness slope tan θ of 0.58 or less as calculated based on a mean height Rc (μm) and a mean width RSm (μm) of profile elements by formula Rc/(0.5×RSm), and
wherein the roughened surface has a small projected area Rc×RSm of 0.45 μm2 or more and 2.00 μm2 or less that is a product of the mean height Rc (μm) and the mean width RSm (μm) of the profile elements,
wherein Rc and RSm are values measured in accordance with JIS B0601-2013 under a condition of not performing a cutoff by a cutoff value λs and a cutoff value λc.