US 12,457,681 B2
Switching power supply including heat sink
Nobuyuki Uchiyama, Shizuoka (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Mar. 30, 2023, as Appl. No. 18/192,785.
Claims priority of application No. 2022-068466 (JP), filed on Apr. 18, 2022.
Prior Publication US 2023/0337355 A1, Oct. 19, 2023
Int. Cl. H05K 1/02 (2006.01); H02M 7/00 (2006.01); H02M 7/217 (2006.01)
CPC H05K 1/0216 (2013.01) [H02M 7/003 (2013.01); H02M 7/217 (2013.01); H05K 1/0203 (2013.01); H05K 2201/066 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A switching power supply apparatus comprising:
a printed substrate;
a transformer including a primary winding and a secondary winding;
a primary-side circuit that is mounted on the printed substrate, that is connected to the primary winding of the transformer, and to which an alternating-current voltage is input;
a secondary-side circuit that is mounted on the printed substrate, connected to the secondary winding of the transformer, and outputs a direct-current voltage;
a semiconductor element mounted on the printed substrate;
a heat sink that includes a connection portion and dissipates heat generated in the semiconductor element, the connection portion being connected to the printed substrate by soldering;
a conductive pattern formed on the printed substrate; and
an inductor that is connected between the connection portion of the heat sink and a part of the pattern, and absorbs electrical noise induced to the heat sink.