US 12,457,680 B2
Circuit board cooling configurations
Ruslan Nagimov, Redmond, WA (US)
Assigned to Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed by Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed on Mar. 13, 2023, as Appl. No. 18/120,900.
Prior Publication US 2024/0314917 A1, Sep. 19, 2024
Int. Cl. H05K 1/02 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/0203 (2013.01) [H05K 1/0212 (2013.01); H05K 7/20372 (2013.01); H05K 2201/064 (2013.01); H05K 2201/09063 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system, comprising:
a circuit board comprising a substrate having a thickness defined between two major surfaces and including inner intermediate and outer generally concentric zones;
a cryogenically cooled chip located in the inner zone;
non-cryogenic electronic components positioned in the outer zone; and,
the intermediate zone defining voids extending through the thickness interposed between bridges extending from the inner zone to the outer zone to create a skeletonized configuration that slows thermal energy movement from the outer zone to the inner zone.