| CPC H04N 23/55 (2023.01) [H04N 23/54 (2023.01)] | 17 Claims |
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1. Modules for assembling a camera unit, the modules comprising:
a circuit board comprising:
an image sensor, and
a solder pad located on an upper surface of the circuit board, and a lens holder for holding a camera lens, comprising a mounting flange with opposed upper and lower surfaces,
wherein the circuit board and lens holder are configured so that when the lens holder and circuit board are assembled together to form the camera module, a lower surface of the lens holder rests adjacent the upper surface of the circuit board, and
wherein the lens holder comprises a throughbore extending between the upper and lower surfaces of the mounting flange, the throughbore positioned to align with the solder pad when the circuit board and lens holder are assembled together, the throughbore being partially occluded at an occlusion location proximate the lower surface of the mounting flange, such that the throughbore has a larger open area proximate the upper surface of the mounting flange than at the occlusion location, the occlusion location being configured to retain a solder ball, and wherein a side of the throughbore includes an optical window configured to allow laser energy to be applied to the solder ball retained within the throughbore via the optical window.
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