US 12,457,280 B2
Electronic device including hinge structure
Woojin Cho, Suwon-si (KR); Choonghyo Park, Suwon-si (KR); Myoungsung Sim, Suwon-si (KR); Ki-Won Kim, Suwon-si (KR); Kiwon Kim, Suwon-si (KR); Joonrae Cho, Suwon-si (KR); and Hochul Hwang, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Jun. 2, 2022, as Appl. No. 17/830,808.
Application 17/830,808 is a continuation of application No. PCT/KR2022/004861, filed on Apr. 5, 2022.
Claims priority of application No. 10-2021-0049709 (KR), filed on Apr. 16, 2021.
Prior Publication US 2022/0337685 A1, Oct. 20, 2022
Int. Cl. H04M 1/02 (2006.01); H04R 1/04 (2006.01); H04R 1/28 (2006.01); H04R 1/40 (2006.01); H04R 3/00 (2006.01)
CPC H04M 1/0218 (2013.01) [H04R 1/04 (2013.01); H04R 1/2876 (2013.01); H04R 1/406 (2013.01); H04R 3/005 (2013.01); H04R 2499/11 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a foldable housing including a first housing part and a second housing part;
a hinge assembly disposed in the foldable housing and configured to rotatably connect the first housing part and the second housing part;
a flexible printed circuit board comprising a connection part disposed at the hinge assembly, the flexible printed circuit board being configured to connect a first electronic component disposed at the first housing part and a second electronic component disposed at the second housing part; and
a microphone module disposed at the connection part of the flexible printed circuit board,
wherein the connection part comprises a hole, and
wherein the microphone module is disposed on a first surface of the connection part such that a microphone hole of the microphone module is connected to the hole of the connection part.