| CPC H04B 3/32 (2013.01) [H04B 3/04 (2013.01)] | 20 Claims |

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16. A communication system comprising:
a signal source in a first thermal environment at a first temperature, the signal source configured to propagate an RF signal;
a superconducting circuit in a second thermal environment at a second temperature lower than the first temperature; and
an RF transmission line system that electrically couples the signal source to the superconducting circuit, the RF transmission line system comprising:
a transmission line conductor configured to propagate the RF signal from the first thermal environment to the second thermal environment;
a dielectric material that is coupled between the transmission line conductor and a ground plane; and
a galvanic connected resonant structure that electrically couples the transmission line conductor to the ground plane.
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