US 12,457,005 B2
Manufacturing method of electronic device
Jen-Hai Chi, Miao-Li County (TW)
Assigned to Innolux Corporation, Miaoli County (TW)
Filed by Innolux Corporation, Miao-Li County (TW)
Filed on Nov. 22, 2021, as Appl. No. 17/533,090.
Claims priority of provisional application 63/127,164, filed on Dec. 18, 2020.
Claims priority of application No. 202111192481.7 (CN), filed on Oct. 13, 2021.
Prior Publication US 2022/0200652 A1, Jun. 23, 2022
Int. Cl. H04B 1/66 (2006.01); H01B 1/12 (2006.01); H01B 13/32 (2006.01); H04B 1/03 (2006.01)
CPC H04B 1/66 (2013.01) [H01B 1/124 (2013.01); H01B 13/32 (2013.01); H04B 1/03 (2013.01); Y10T 29/49165 (2015.01)] 17 Claims
OG exemplary drawing
 
1. A manufacturing method of an electronic device, comprising:
providing a substrate;
forming a first opening so that the first opening penetrates the substrate; and
forming a polymer layer in the first opening, wherein the polymer layer is in contact with a sidewall of the substrate at the first opening;
forming a first conductive layer pattern on a surface of the substrate;
forming a second conductive layer pattern on another surface of the substrate, wherein the another surface is opposite to the surface; and
forming a second opening in the polymer layer, wherein the second opening exposes the second conductive layer pattern;
wherein before forming the second opening in the polymer layer, the manufacturing method further comprises:
forming a dielectric layer on the surface of the substrate to cover the first conductive layer pattern;
forming a conductive layer pattern on the dielectric layer so that the conductive layer pattern is electrically coupled to the first conductive layer pattern.