US 12,456,960 B2
Temperature compensated acoustic wave device with multilayer interdigital transducer electrode including buffer layer
Takanori Yasuda, Nara (JP); Keiichi Maki, Suita (JP); Yumi Torazawa, Takatsuki (JP); Rei Goto, Osaka (JP); and Michael David Hill, Emmitsburg, MD (US)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Mar. 1, 2023, as Appl. No. 18/176,974.
Claims priority of provisional application 63/315,873, filed on Mar. 2, 2022.
Prior Publication US 2023/0318566 A1, Oct. 5, 2023
Int. Cl. H03H 9/02 (2006.01); H03H 9/64 (2006.01)
CPC H03H 9/02834 (2013.01) [H03H 9/02574 (2013.01); H03H 9/64 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A temperature compensated surface acoustic wave device comprising:
a piezoelectric layer;
an interdigital transducer electrode over the piezoelectric layer, the interdigital transducer electrode including a first layer, a second layer over the first layer, and a buffer layer between the first layer and the second layer, a thermal conductivity of the buffer layer being greater than a thermal conductivity of the first layer and a thermal conductivity of the second layer being greater than the thermal conductivity of the buffer layer, a thickness of the buffer layer being in a range of 20 nm to 200 nm; and
a temperature compensation layer over the interdigital transducer electrode.