US 12,456,702 B2
Device, method and system to mitigate stress on hybrid bonds in a multi-tier arrangement of chiplets
Kimin Jun, Portland, OR (US); Feras Eid, Chandler, AZ (US); Adel Elsherbini, Tempe, AZ (US); Aleksandar Aleksov, Chandler, AZ (US); Shawna Liff, Scottsdale, AZ (US); Johanna Swan, Scottsdale, AZ (US); and Julien Sebot, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 25, 2021, as Appl. No. 17/359,380.
Prior Publication US 2022/0415837 A1, Dec. 29, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 24/08 (2013.01) [H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/562 (2013.01); H01L 24/80 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2225/06586 (2013.01); H01L 2924/351 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A packaged device comprising:
a host die;
a first plurality of dies each bonded at the host die via a respective hybrid bond interface of a first plurality of hybrid bond interfaces;
a second one or more dies each coupled to the host die via a respective one of the first plurality of dies, and via a respective hybrid bond interface of a second one or more hybrid bond interfaces, wherein a first tier of a multi-tier configuration of multiple dies comprises the first plurality of dies, and wherein a second tier of the multi-tier configuration comprises the second one or more dies;
an encapsulation structure comprising a first body of a first mold compound material, and a second body of a second mold compound material;
wherein:
the first mold compound material and the second mold compound material have different compositions;
the first body and the second body each extend in a region between a first die and a second die of the multiple dies;
the first tier comprises the first die and the second die; and
the first body and the second body each extend to both:
a first vertical level of the first plurality of hybrid bond interfaces; and
a second vertical level of the second one or more hybrid bond interfaces.