| CPC H01L 23/562 (2013.01) [H01L 21/4814 (2013.01); H01L 23/50 (2013.01)] | 18 Claims |

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1. A semiconductor apparatus comprising:
a semiconductor device;
a first external connection terminal configured to be connected to the semiconductor device, the first external connection terminal including a first surface and a second surface opposing the first surface; and
an insulating resin enclosure including:
an inner wall that defines a space for housing the semiconductor device and is along a first direction that is directed from the first surface to the second surface;
a first recessed part that exposes the second surface of the first external connection terminal;
a first extending part that defines the first recessed part; and
a second extending part that defines the first recessed part and is spaced apart from the first extending part along a third direction that is along a width direction of the first external connection terminal,
wherein:
the first external connection terminal includes:
a base part that is embedded in the insulating resin enclosure; and
a protruding part that protrudes from the inner wall of the insulating resin enclosure,
the second surface of the first external connection terminal includes:
a first part that corresponds to the protruding part; and
a second part that corresponds to the base part and is exposed by the first recessed part,
the first part and the second part are continuous with each other along a second direction in which the protruding part of the first external connection terminal protrudes,
the first and second extending parts are spaced apart from each other in the third direction, and
each of the first and second extending parts extends along the first direction from a position corresponding to the second surface of the first external connection terminal.
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