US 12,456,690 B2
Modular power overlay device and method
Liqiang Yang, Gloversville, FL (US); Darrell Lee Grimes, Boca Raton, FL (US); Richard Anthony Eddins, Margate, FL (US); Shung Ik Lee, Pompano Beach, FL (US); and Judd Everett Swanson, Plantation, FL (US)
Assigned to GE AVIATION SYSTEMS LLC, Grand Rapids, MI (US)
Filed by GE AVIATION SYSTEMS LLC, Grand Rapids, MI (US)
Filed on May 6, 2022, as Appl. No. 17/738,498.
Prior Publication US 2023/0361049 A1, Nov. 9, 2023
Int. Cl. H01L 23/538 (2006.01); H01L 23/14 (2006.01); H01L 23/485 (2006.01); H01L 25/18 (2023.01); H02M 7/5387 (2007.01); H05K 1/18 (2006.01)
CPC H01L 23/5386 (2013.01) [H01L 23/147 (2013.01); H01L 23/485 (2013.01); H01L 25/18 (2013.01); H02M 7/5387 (2013.01); H05K 1/181 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10166 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A modular power overlay (POL) device, comprising:
a first POL component comprising:
a first dielectric layer having a first side and an opposing second side;
a first conductive layer disposed on the first dielectric layer first side;
a set of first semiconductor switching devices each comprising a respective source terminal, drain terminal, and gate terminal, the set of first semiconductor switching devices disposed on the first dielectric layer second side and arranged to cooperatively define a first half-bridge converter circuit, the first conductive layer electrically coupled to each respective source terminal through the first dielectric layer;
a first electrically conductive substrate having a first side facing the set of first semiconductor switching devices, electrically coupled to each respective gate terminal of the set of first semiconductor switching devices, and an opposing second side;
a first DC input node including a first DC input terminal electrically coupled to a respective drain terminal of a first one of the set of first semiconductor switching devices;
a second DC input node including a second DC input terminal electrically coupled to a respective source terminal of a second one of the set of first semiconductor switching devices;
a first AC output terminal electrically coupled to a respective source terminal of the first one of the set of first semiconductor switching devices, and a drain terminal of the second one of the set of first semiconductor switching devices; and
an electrically insulative baseplate, facing and coupled to the second side of the first electrically conductive substrate, wherein the first electrically conductive substrate is positioned between the set of first semiconductor switching devices and the electrically insulative baseplate.