US 12,456,688 B2
High aspect ratio via fill process employing selective metal deposition and structures formed by the same
Takashi Yamaha, Obu (JP); Tatsuya Hinoue, Yokkaichi (JP); and Fumitaka Amano, Yokkaichi (JP)
Assigned to Sandisk Technologies, Inc., Milpitas, CA (US)
Filed by SANDISK TECHNOLOGIES LLC, Addison, TX (US)
Filed on Nov. 29, 2022, as Appl. No. 18/059,698.
Application 18/059,698 is a continuation in part of application No. 17/821,659, filed on Aug. 23, 2022.
Application 17/821,659 is a continuation in part of application No. 17/566,262, filed on Dec. 30, 2021, granted, now 12,087,628.
Application 17/566,262 is a continuation in part of application No. 17/509,323, filed on Oct. 25, 2021, granted, now 12,087,626.
Prior Publication US 2023/0130849 A1, Apr. 27, 2023
Int. Cl. H01L 23/535 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01); H10B 41/27 (2023.01); H10B 43/27 (2023.01)
CPC H01L 23/535 (2013.01) [H01L 21/76805 (2013.01); H01L 21/76843 (2013.01); H01L 21/76879 (2013.01); H01L 21/76895 (2013.01); H01L 23/53209 (2013.01); H01L 23/53238 (2013.01); H01L 23/53242 (2013.01); H01L 23/53257 (2013.01); H10B 41/27 (2023.02); H10B 43/27 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A metal interconnect assembly, comprising:
a first metal interconnect structure embedded in a first dielectric material layer; and
a second metal interconnect structure embedded in a second dielectric material layer and comprising a metal line portion having a top surface located within a first horizontal plane and having a bottom surface located within a second horizontal plane, and further comprising a metal via portion adjoined to a bottom of the metal line portion and contacting a top surface of the first metal interconnect structure,
wherein the second metal interconnect structure comprises a metallic liner comprising a first metallic material that comprises an entire volume of the metal via portion and an outer part of the metal line portion and in direct contact with a dielectric sidewall of the second dielectric material layer, and a metallic fill material portion comprising a second metallic material that comprises an inner part of the metal line portion, does not contact the second dielectric material layer and is spaced from the second dielectric material layer by the metallic liner.